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Sunday, April 19, 2020 | History

3 edition of 1997 IEEE International Conference on Microelectronics Test Structures Proceedings found in the catalog.

1997 IEEE International Conference on Microelectronics Test Structures Proceedings

March 17-20, 199Y, Monterey, California

by IEEE

  • 200 Want to read
  • 24 Currently reading

Published by Institute of Electrical & Electronics Enginee .
Written in English

    Subjects:
  • Electronic devices & materials,
  • Engineering measurement & calibration,
  • Electronic Measurements,
  • Microelectronics,
  • Technology & Engineering,
  • Technology & Industrial Arts,
  • Science/Mathematics,
  • Electricity,
  • Engineering - Electrical & Electronic,
  • Electronics - Microelectronics

  • Edition Notes

    ContributionsIEEE Industry Applications Society (Editor)
    The Physical Object
    FormatPaperback
    Number of Pages225
    ID Numbers
    Open LibraryOL10998904M
    ISBN 100780332431
    ISBN 109780780332430

    Proceedings of the IEEE International Interconnect Technology Conference (Cat. NoEX) p. () Z. Bian, E. O. Shaffer, and R. E. Geer Development of TaSiN Diffusion Barriers for Cu/SiLK Metallization Schemes Proceedings of the IEEE International Interconnect Technology Conference (IEEE Cat. 01EX) p. (). Conference Proceedings. International Symposium on Field-Programmable Gate Arrays, ACM/IEEE. Ostler, Patrick, Wirthlin, Michael J, & Jensen, Josh. (December ). FPGA Bootstrapping on PCIe Using Partial Reconfiguration. Conference Proceedings. International conference on Reconfigurable Computing and FPGAs (Reconfig), IEEE. Verification of “lateral secondary ion mass spectrometry” as a method for measuring lateral dopant dose distributions in microelectronics test structures Microelectronics and Nanometer Structures Processing M. Franosch, W. Hösler, F. Jahnel, R. Lange-Gieseler, and I. Weitzel, in Proceedings of the 10th International Conference on Cited by: 5. Microelectronic Test Structures, ICMTS Proceedings. IEEE International Conference on Moran, S and Hurley, PK and Mathewson, A () Test structure for investigating activated doping concentrations in polycrystalline silicon Microelectronic Test Structures, ICMTS


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1997 IEEE International Conference on Microelectronics Test Structures Proceedings by IEEE Download PDF EPUB FB2

Get this from a library. IEEE International Conference on Microelectronic Test Structures Proceedings. [IEEE, Electron Devices Society Staff,; IEEE, Institute of Electrical and Electronics Engineers, Inc. Staff,]. Get this from a library. IEEE International Conference on Microelectronic Test Structures proceedings: March, Monterey, California.

[IEEE Electron Devices Society.;]. Proceedings of 17th International Conference of the Engineering in Medicine and Biology Society, A two-dimensional finite element 1997 IEEE International Conference on Microelectronics Test Structures Proceedings book of the human head and brain stem has been developed to examine the current spread and electric fields generated during stimulation by an auditory brainstem implant.

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Brauch J and Fleischman J DESIGN OF CACHE TEST HARDWARE ON THE HP PA Proceedings of the IEEE International Test Conference Kantabutra V () On Hardware for Computing Exponential and Trigonometric Functions, IEEE Transactions on Computers,(), Online publication date: 1-Mar M.

Niewczas, “Characterization of the Threshold Voltage Variation: A Test Chip and the Results,” IEEE Int. Conference on Microelectronics Test Structures, vol. 10, pp.Google ScholarAuthor: Manoj Sachdev, José Pineda de Gyvez.

Power Apparatus and Systems, Part III. Transactions of the American Institute of Electrical Engineers. 12th Learning and Technology Conference, Electrical Overstress/Electrostatic Discharge Symposium, 29th Electrical Overstress/Electrostatic Discharge Symposium, 3-D Digital Imaging and Modeling, The book is a collection of best papers presented in the Second International Conference on Microelectronics Electromagnetics and Telecommunication (ICMEET ), an.

“Design and Characterization of SiGe TFT Devices and Process using Stanford’s Test Chip Design Environment”, M. Kumar, V. Subramanian, K. Saraswat, J. Plummer, and W. Lukaszek, Proceedings of the IEEE International Conference on. Conference Proceedings., IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP, IEEE International Conference on.

Full text of "Proceedings of the Intenational Conference on Intelligent Systems and Semiotics" See other formats. V.Y. Kim and T. Chen, “SRAM Yield Estimation in the Early Stage of the Design Cycle,” IEEE International Workshop on Memory Technology, Design and Testing, San Jose, CA, AugustC.

Anderson, A. von Mayrhauser, C.R. Gideon, T. Chen, and J. Kok, “Test Coverage Prediction of VHDL Models Using Neural Networks,” Annual. Tompson, A. Dolin and P. Kinget, "GHz RF Inductive Power Delivery for Contactless On-Wafer Characterization," IEEE International Conference on Microelectronic Test Structures (ICMTS), pp.

-March Madhavan Swaminathan is the John Pippin Chair in Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the 3D Systems Packaging Research Center (PRC) at Georgia Tech.

He formerly held the position of Joseph M. Pettit Professor in Electronics in ECE and Deputy Director of the NSF Microsystems Packaging Research Center, Georgia Tech.

Prior. He has authored and coauthored more than 80 papers published in peer-reviewed journals and more than 50 papers published in international conference proceedings.

He serves or served as a technical program committee member of the IEEE International Electron Devices Meeting (IEDM), and the IEEE International Reliability Physics Symposium (IRPS). Xiaoning Qi, S. Shen, Z. Hsiau, Z. Yu and R. Dutton, "Layout-based 3-D solid modeling of IC structures and interconnects including electrical parameter extraction," Proceedings of IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp.Sept.

Proceedings, IEEE Computer Society Annual Symposium on VLSI (ISVLSI 07), Porto Alegre, Brazil, May[C21] Y. Kumar and P. Gupta. Reducing EPL Alignment Errors for Large VLSI Layoutsâ€, Proceedings, 8th IEEE International Conference on Quality Electronic Design (ISQED 07), San Jose, CA,March Lynch, K.

M., Jan 1In: Proceedings - IEEE International Conference on Robotics and Automation. 2, p. 6 p. Research output: Contribution to journal › Article Friction.

“A multi-scale framework for nano-electronic devices modeling with application to the junctionless transistor,” IEEE International Conference of Electron Devices and Solid-State Circuits, Hong Kong, China, pp. 1–2, June Jiun-Lang Huang, Kwang-Ting Cheng, Analog Fault Diagnosis for Unpowered Circuit Boards, Proceedings of the IEEE International Test Conference, p, NovemberJens P.

Brage, Jan Madsen, A codesign case study in computer graphics, Proceedings of the 3rd international workshop on Hardware/software co-design, September Cited by:   In: Proceedings of the international symposium on microelectronics, Seattle, 17–19 Octoberpp – Google Scholar 7. Lo G, Sitaraman SK () G-helix: lithography-based, wafer-level compliant chip-to-substrate : Harry K.

CharlesJr. Ahmed Khawaja, Jiajun Wang, Dhairya Malhotra, Andreas Gerstlauer, George Biros, and Lizy K. John, "Performance Analysis of HPC Applications with Irregular Tree Data Structures," Proceedings of the IEEE International Conference on Parallel and Distributed Systems (ICPADS), Hsinchu, Taiwan, December In Electron Devices Meeting, IEEE International, pp.

– (). Bohr, M., “The new era of scaling in an SoC world.” In Solid-State Conference, IEEE International, Digest of Technical Papers, pp. 23–28 (). Microelectronics and Nanometer Structures, 24 (1), – Published Papers CMOS Technology. The full text for most of these papers may be found at the IEEE website at T Uchino 1, 2, E Gili 1, 3, L Tan 4, O Buiu 4, S Hall 4 and P Ashburn 1, "Improved vertical MOSFET performance using an epitaxial channel and a stacked silicon-insulator structure" School of Electronics and Computer Science, University of Southampton, Southampton.

Senesky, D.G., and A.P. Pisano, “Aluminum Nitride as a Masking Material for the Plasma Etching of Silicon Carbide Structures,” In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Hong Kong, [2] Proceeding of 5th International Conference on Electronics Materials and Packaging, Sung Yi, D.

Whalley and K. Teo, (Eds.), ISBN:[1] Proceeding of 1st International Conference on Electronics Materials and Packaging, Sung Yi and Kerm Sin Chian, (Eds.), Book & Technical Reports. Proceedings of the IEEE, vol. 90, no. 6, pp. ©IEEE: Overview: Neudeck, Okojie, Chen: Design Considerations for Bulk Micromachined 6H-SiC High-g Piezoresistive Accelerometers: Conference Paper: Technical Digest of the 15th IEEE International Conference on MEMS, p.

(IEEE # 02CH) ©IEEE: Sensors, MEMS. ICASSP - IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP), () Exact Synthesis of Nearest Neighbor Compliant Quantum Circuits in 2-D Architecture and Its Application to Large-Scale by: Latest Publications.

Zhang, L., Wu, J., Mumtaz, S., Li, J., Gacanin, H. and Rodrigues, J.: Edge-to-Edge Cooperative Artificial Intelligence in Smart Cities with On. Conference Title Book Title Series Description Mtg Year Editor ISBN Pages Format POD Publisher Publ Year Subject1 Subject2 Subject3 Subject4 List Price Institute of Electrical and Electronics Engineers (IEEE) INFORMATION NETWORKING.

INTERNATIONAL CONFERENCE. (ICOIN ) (2 VOLS) International Conference on Information Networking. [’16] Armen Dzhagaryan, Aleksandar Milenković, "Models for Evaluating Effective Throughputs for File Transfers in Mobile Computing," in the Proceedings of the IEEE 25th International Conference on Computer Communications and Networks (ICCCN ), pp.

August, Waikoloa, Hawaii, USA. DOI: /ICCCN M. Tegethor and T. Chen, "Manufacturing Test Simulator: A Concurrent Engineering Tool for Boards and MCMs", International Test Conference, Washington D.C., October F.

Alzahrani and T. Chen, "On-Chip TEC-QED ECC for Ultra-Large, Single-Chip Memory Systems", IEEE International Conference on Computer Design: VLSI in Computers and. Bayoumi and E. Friedman (Eds.), Proceedings of the IEEE Workshop on Signal Processing Systems Design and Implementation, IEEE Press,ISBN # J.

Becerra and E. Friedman (Eds.), Analog Design Issues in Digital VLSI Circuits and Systems, Norwell, Massachusetts:Kluwer Academic Publishers,ISBN # She is a senior member of IEEE and has served as a member of the technical program committee of IEEE IEDM (), IEEE Sensors Conference (), the Hilton Head workshop (, ), the IEEE MEMS Conference (), Transducers (), and IFCS ().

She is an associate editor of the IEEE Electron Device Letters. Subsequently, this section will demonstrate how analog testability can be improved by the inclusion of test buses and probe points, as well other, more powerful test structures, such as on-chip signal generators and parameter extraction circuits.

We shall also describe BIST schemes for analog-to-digital converters, CODECs, transcievers and PLLs. Foley, S,Motyneaux, J,Mathewson, A,IEEE,IEEE () ICMTS PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES Evaluation of test methods and associated test structures for interconnect reliability control, pp He acted as general chairman of the International Image Sensor Workshop (formerly IEEE International Workshop on Charge-Coupled Devices and Advanced Image Sensors) in, and He is member of the Steering Committee of the aforementioned workshop and founder of the Walter Kosonocky Award, which highlights the best paper in the field.

Journal description. Microelectronics Reliability is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems. * “The Era of Embedded Intelligence,” Keynote Speaker, The 4 th International Conference on Reliability, Safety and Hazard, Indian Institute of Technology, Chennai, India, Jan* Keynote Speaker.

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Fan, Y. Cai and Z. Zilic, "A High Accuracy, High Throughput Jitter Test Solution on ATE for 3 Gbps and 6 Gbps Serial-ATA", Proceedings of IEEE International Test Conference, ITC'07, Oct.10 pages.The field emission arrays of SiC sharp emitter tips have been produced for the first time by use of the transfer mold technique.

The test structures of active gun, containing approximately 3× of Cited by: 8.